SECTION 09 30 00 - 4 MODIFIED 05/2023
TILE & STONE INSTALLATION ARDEX AMERICAS
any contaminant that might act as a bond breaker. If necessary, mechanically clean the floor down to
sound, solid concrete by shot blasting or similar. If necessary, mechanically clean the floor down to
sound, solid concrete by shot blasting or similar. Over-watered, frozen or otherwise weak concrete
surfaces also must be cleaned down to sound, solid concrete by mechanical methods. Sanding
equipment is not an effective method to removed contaminants from the concrete.
D. Wood:
1. The wood subfloor must be constructed according to prevailing building codes. It must be
solid and securely fixed to provide a rigid base free of undue flex. For tile installations, the
subfloor must be constructed in accordance with ANSI L/360 or ANSI L/720 standards.
Any boards exhibiting movement must be properly fastened. The surface of the wood must
be clean and free of oil, grease, was, dirt, varnish, shellac and any contaminant that might
act as a bond breaker. If necessary, sand down to bare wood. A commercial drum sander
can be used to sand large areas. Do not use solvents, strippers or cleaners. Vacuum all dust
and debris. Open joints should be filled with ARDEX SKM. It is the responsibility of the
installation contractor to ensure that the wood subfloor is thoroughly clean and properly
anchored prior to the installation of any ARDEX material.
2. Exterior grade plywood and OSB subfloors must be either 5/8” (approx. 15 mm) or
3
/
4
” (18
mm) tongue and groove. Fasten plywood or OSB every 6” (15 cm) o.c. along sheet ends
and 8” (20 cm) o.c. along intermediate supports with ring-shank nails or screws. Allow 1/8”
(approx. 3 mm) between sheets. All sheet ends must be supported by a framing member and
properly fastened.
3. The underlayment must be constructed of 3/8” (9 mm) plugged-faced exterior grade
plywood or OSB and fastened every 6” (15 cm) along sheet ends and 8” (20 cm) in the panel
field with ring-shank nails or screws. Allow 1/8” (approx. 3 mm) between sheets on all
edges and ends and
1
/
4
” (approx. 6 mm) at perimeter walls and any abutting surfaces. Offset
underlayment joints from the joints in the subfloor.
4. Please refer to the technical data sheet for information on joist spacing and minimum
subfloor requirements.
E. Highly-Absorbent Substrates:
1. High-absorbent substrates, such as gypsum, must be double primed with ARDEX P 51™
Primer.
2. The substrate must be thoroughly clean and free of dirt, debris, sealers and any contaminant
that might act as a bond breaker. If necessary, mechanically clean the floor down to sound,
solid material by shot blasting or similar.
F. Existing Tiles: Contact the ARDEX Technical Department for specific substrate requirements.
G. Joint and Crack Preparation:
1. All existing expansion joints, isolation joints and construction joints, as well as all moving
cracks must be honored up through the substrate, uncoupling membrane and tile or stone as
indicated by TCNA or TTMAC guidelines. These joints must also be honored up through
the heating cables.